Expertise at Chang Gung System

Tsai, Ming-Yi ,Ph.D.
Institution: Chang gung university
Position: Professor
Department: Department of Mechanical Engineering
Address: 259, Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan 333, Taiwan
Tel: +886 -2118800 ext 5743 Fax: +886-2118346
E-mail: mytsai@mail.cgu.edu.tw

Focus of Interest:
  • Solid Mechanics: Electronics/Optoelectronics Packaging, Photomechanics, Adhesive Bonding, and Mechanics of Composite Materials

Fulltime Employment:
  • Research Associate, Department of Engineering Science and Mechanics, Virginia Tech, USA, Jan. 1991 ~ Aug. 1993
  • Research Scientist, Department of Engineering Science and Mechanics, Virginia Tech, USA, Sept. 1993 ~ Aug. 1996
  • Research Scientist, Tjing Ling Research Institute, National Taiwan University, Taiwan, Aug. 1996 ~ Jul. 1997
  • Associate Professor, Department of Mechanical Engineering, Chang Gung University, Taiwan, Aug. 1997 ~ Jul. 2006
  • Professor, Department of Mechanical Engineering, Chang Gung University, Taiwan, Aug. 2006

Education:
  • Ph.D., Engineering Science and Mechanics, Virginia Polytechnic Institute and State University (Virginia Tech), USA (1990)
  • M.S., Engineering Science and Mechanics, Virginia Polytechnic Institute and State University (Virginia Tech), USA (1988)
  • B.S., National Cheng Kung University, Taiwan (1982)

Selected Main Publications:
  1.  Tsai, M. Y., Oplinger, D. W. and Morton, J., " Improved Theoretical Solutions of Adhesive Joints, " Int. J. Solids and Structures, Vol. 35, No. 12, pp.1163-1185, 1998. (SCI/EI)
  2.  Tsai, M. Y., Hsu, C. H. and Wang, C. T., “Investigation of Thermomechanical Behaviors of Flip Chip BGA  Packages During Manufacturing Process and Thermal Cycling,” IEEE Transactions on Components and Packaging Technologies Vol. 27, No. 3, pp.568-576, 2004. (SCI/EI)
  3. Tsai, M. Y. and Chen, C. H., “Evaluation of Test Methods for Silicon Die Strength,” Microelectronics Reliability, Vol. 48, No. 6, pp.933-941, June 2008
  4.  M. Y. Tsai, C. H. Chen, and W. L. Tsai, “Thermal Resistance and Reliability of High-Power LED Packages under WHTOL and Thermal Shock Tests,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 4, pp. 738-746, Dec. 2010.
  5.  M. Y. Tsai, P. S. Huang, C. Y. Huang, H. Jao, B. Huang, B. Wu, Y. Y. Lin, W. Liao, J. Huang, L. Huang, S. Shih, and J. P. Lin, “Investigation on Cu TSV-Induced KOZ in Silicon Chips: Simulations and Experiments,” IEEE Transactions on Electron Devices, Vol. 60, No. 7, pp.2331-2337, July 2013


All Publications List